We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Opening device.
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Opening device Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

Opening device Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. ハイテック・システムズ Kanagawa//Industrial Machinery
  2. null/null
  3. 日本サイエンティフィック Tokyo//Electronic Components and Semiconductors
  4. 4 ハイソル Tokyo//Electronic Components and Semiconductors
  5. 5 雄山 東京支店 Tokyo//others
Go to Company Ranking

Opening device Product ranking

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. IC package opening device ハイテック・システムズ
  2. Semiconductor package opening technology (Cu wire, Au wire)
  3. Plastic Mold IC Opener PS105 日本サイエンティフィック
  4. 4 Package opening device ハイソル
  5. 5 Can opener 雄山 東京支店

Opening device Product List

1～6 item / All 6 items

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IC package opening device

IC package opening device

Package removal without causing physical or electrical damage! High selectivity etching.

We provide a device for failure analysis adapted for the packaging of advanced IC and other devices. Our unique new plasma technology, MIP (Microwave Induced Plasma), uses O2 (oxygen) plasma to remove the packaging. Additionally, the device can automatically perform a series of processes including etching, cleaning, and drying within a single unit. 【Features】 ■ Microwave Induced Plasma ■ O2 Plasma ■ Atmospheric Pressure Process ■ Fully Automatic Process *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Ultrasonic Cleaner
  • Drying Equipment

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Automatic Deleting (Unpacking) 'DL'

Automatic Deleting (Unpacking) 'DL'

Liner removal is assisted by vacuum! For processing syringes or cartridges, etc.

The "DL" is suitable for handling vials, syringes, or cartridges of tabs. Preheating of the tab edge prevents fine particles during the removal of the lid. Liner removal is assisted by vacuum. We also offer optional equipment such as process data accumulation software compliant with FDA 21CFR Part 11. 【Features】 ■ Compact machine ■ Preheating of the tab edge prevents fine particles during lid removal ■ Liner removal is assisted by vacuum ■ Maximum output: 225 tabs/h ■ cGMP-US FDA compliant *For more details, please refer to the PDF document or feel free to contact us.

  • others

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Package opening device

Package opening device

This is a package opening device suitable for failure analysis. With our unique technology, it has become possible to open packages of Cu wires that were previously difficult to open.

Features ● Forms a coating on "copper" using proprietary technology to protect it from acidic solutions ● Lowers acidic solutions to 10°C for low irritation upon opening ● Compatible with Cu, Al, and Au wires ● Automatically produces mixed acid in 13 different ratios ● Waste liquid is discharged separately for each acidic solution, eliminating concerns about mixing acids with different boiling points

  • Visual Inspection Equipment

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Can opener

Can opener

Can opener

This is a manual opening device designed for TO packages primarily used in laser diodes. 【Features】 ◆ Significantly reduces work time as there is no need for cumbersome manual condition setting. ◆ The quality of the opening is not dependent on the operator's skill level, making the opening process easy for anyone. Effective in reducing sample damage. ◆ Comes with a safety cover to protect hands and fingers from the circular blade during handling and operation.

  • Other semiconductor manufacturing equipment

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